3D IC Integration and Packaging

August 27, 2015|
3D IC Integration and Packaging by John H. Lau
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A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications

Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors.

Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions.

  • Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging
  • Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping
  • Practical applications of 3D IC technology are covered in full detail
  • Author has written 16 engineering books and published more than 350 peer-reviewed papers
John Lau, Ph.D., is a Fellow of Industrial Technology Research Institute (ITRI), a Taiwan-based nonprofit R&D organization engaging in applied research and technical services. Previously, he was a visiting professor at the Hong Kong University of Science and Technology (HKUST), director of the Microsystems, Modules & Components...
Title:3D IC Integration and PackagingFormat:HardcoverProduct dimensions:9.5 X 7.7 X 1.15 inShipping dimensions:9.5 X 7.7 X 1.15 inPublished:August 27, 2015Publisher:McGraw-Hill EducationLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0071848061

ISBN - 13:9780071848060

Appropriate for ages: All ages

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