3d Stacked Chips: From Emerging Processes To Heterogeneous Systems

May 26, 2018|
3d Stacked Chips: From Emerging Processes To Heterogeneous Systems by Ibrahim (abe) M. Elfadel
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Ibrahim (Abe) M. Elfadel has 15 years of industrial experience in the research, development and deployment of advanced computer-aided design (CAD) tools and methodologies for deep-submicron, high-performance digital designs. Most recently, he played a key role in the development and deployment of IBM''s next-generation ...
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Title:3d Stacked Chips: From Emerging Processes To Heterogeneous Systems
Format:Paperback
Product dimensions:339 pages, 9.25 X 6.1 X 0 in
Shipping dimensions:339 pages, 9.25 X 6.1 X 0 in
Published:May 26, 2018
Publisher:Springer Nature
Language:English
Appropriate for ages:All ages
ISBN - 13:9783319793054

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