Advanced Wirebond Interconnection Technology by Shankara K. PrasadAdvanced Wirebond Interconnection Technology by Shankara K. Prasad

Advanced Wirebond Interconnection Technology

byShankara K. Prasad

Hardcover | April 30, 2004

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Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
Title:Advanced Wirebond Interconnection TechnologyFormat:HardcoverDimensions:669 pagesPublished:April 30, 2004Publisher:Springer-Verlag/Sci-Tech/TradeLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:1402077629

ISBN - 13:9781402077623

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Table of Contents

Materials for Wire Bonding.- Bonding Equipment.- Process Technology.- Quality.- Reliability.- New Technologies and New Applications for Wire Bonding.

Editorial Reviews

From the reviews:"..intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.. This book has excellent overall tutorial and enough description of wire and bonding equipment.. If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter)"This book is intended for an assembly . . is very good with 'visual' explanations for quick grasping of the issues. . The book has a clear prose style and a very readable font and page layout. . has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. . A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)