Advances In Cmp Polishing Technologies

Paperback | October 30, 2017

byToshiro DoiEditorIoan D. Marinescu, Syuhei Kurokawa

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field making cutting-edge R proprietary information , and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology the science of friction, wear and lubrication the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field making cutting-edge R proprietary information , a...

Format:PaperbackDimensions:328 pages, 8.75 × 6.35 × 0.68 inPublished:October 30, 2017Publisher:William Andrew PublishingLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0128103566

ISBN - 13:9780128103562

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Table of Contents

Chapter 1: Introduction

Chapter 2: Device fabrication with a silicon crystal substrate

Chapter 3: Ultra-precision technology taking silicon single crystal as an example

Chapter 4: Applications of ultra-precision CMP in device processes

Chapter 5: The future of processing technology

Chapter 6: Progress of the semiconductor and silicon industries

Chapter 7: Summary