Bonding in Microsystem Technology by Jan A. DziubanBonding in Microsystem Technology by Jan A. Dziuban

Bonding in Microsystem Technology

byJan A. Dziuban

Paperback | November 25, 2010

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Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three - dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique. Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author's personal experience. Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources.
Title:Bonding in Microsystem TechnologyFormat:PaperbackDimensions:350 pagesPublished:November 25, 2010Publisher:Springer NetherlandsLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:9048171512

ISBN - 13:9789048171514

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Table of Contents

Acknowledgments. List of Acronyms and Symbols. 1. Introduction. 2. Some remarks on microsystem systematic and development. 2.1 Literature3. Deep three-dimensional silicon micromachining. 3.1 Micromechanical substrates and mechanical properties of silicon. 3.2 Wet anisotropic etching of silicon. 3.3 Basic micromechanical constructions. 3.4 Literature4. Bonding. 4.1 Surface cleaning and activation. 4.2 High temperature fusion bonding. 4.3 Low temperature bonding. 4.4 Anodic (electrostatic) bonding. 4.5 Literature5. Classification of bonding and closing remarks. 5.1 Literature

Editorial Reviews

From the reviews:"Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. . Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)