Carbon Nanotubes for Interconnects: Process, Design and Applications by Jean Dijon

Carbon Nanotubes for Interconnects: Process, Design and Applications

byJean Dijon, Antonio Maffucci, Aida Todri-Sanial

Kobo ebook | July 9, 2016

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This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Title:Carbon Nanotubes for Interconnects: Process, Design and ApplicationsFormat:Kobo ebookPublished:July 9, 2016Publisher:Springer International PublishingLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:3319297465

ISBN - 13:9783319297460

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