Computer-Aided Design of High-Temperature Materials by Alexander PechenikComputer-Aided Design of High-Temperature Materials by Alexander Pechenik

Computer-Aided Design of High-Temperature Materials

EditorAlexander Pechenik, Rajiv K. Kalia, Priya Vashishta

Hardcover | August 15, 1999

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High-temperature materials is a fast-moving research area with numerous practical applications. Materials that can withstand extremely high temperatures and extreme environments are generating considerable attention worldwide; however, designing materials that have low densities, elevatedmelting temperatures, oxidation resistance, creep resistance, and intrinsic toughness encompass some of the most challenging problems in materials science. The current search for high-temperature materials is largely based on traditional, trial-and-error experimental methods which are costly and time-consuming. An effective way to accelerate research in this field is to use recent advances in materials simulations and high performance computing andcommunications (HPCC) to guide experiments. This synergy between experiment and advanced materials modeling will significantly enhance the synthesis of novel high-temperature materials. This volume collects recent work from experimental and computational scientists on high-temperature materials and emphasizes the potential for collaboration. It features state-of-the-art materials modeling and recent experimental developments in high-temperature materials. Topics includefundamental phenomena and properties; measurements and modeling of interfacial phenomena, stresses, growth of defects, strain, and fracture; and electronic structure and molecular dynamics.
Alexander Pechenik is at Air Force Office of Scientific Research.
Title:Computer-Aided Design of High-Temperature MaterialsFormat:HardcoverPublished:August 15, 1999Publisher:Oxford University PressLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0195120507

ISBN - 13:9780195120509

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Table of Contents

S. M. Wiederhorn and W. E. Luecke: Creep of Silicon NitrideM. P. Harmer et al.: Grain Boundary Chemistry and Creep Resistance of AluminaStuart Ansell, Shankar Krishnan, and David L. Price: The Structures of Liquid Yttrium and Aluminum OxidesRichard A. Page: Creep Damage Processes in Structural Ceramics: Experimental Studies and Their Implications for Computational ModelingC. S. Jayanthi et al.: Insights on Deformation Mechanisms from Atomistic Modeling of Structural Instability in SolidsShi-He Wang, Philip C. Clapp, and Jon A. Rifkin: Molecular Dynamics Simulation of the Sintering Process of V-SiC NanoparticlesAndrey Omeltchenko et al.: Dynamic Fracture in Nanophase Ceramics and Diamond Films: Multimillion Atom Parallel Molecular-Dynamics SimulationsE. Bouchard and P. Daguier: Scaling Phenomena in Crack PropagationP. Peralta et al.: Effect of Small Aluminum Additions on Mechanical, Elastic and Structural Properties of Monocrystalline C11b MoSi2L. Greengard: Nearly Singular Fields: Electrostatics and Elastostatics of Composite MaterialsKaushik Bhattacharya: Energy Minimization and Nonlinear Problems in Polycrystalline SolidsRobert Lipton: Influence of the Interface on the Thermal Conductivity of Composites Containing Perfectly Conducting or Perfectly Insulating ParticlesAlan J. Ardell: Coarsening of Directionally-Solidified Eutectic MicrostructuresRobin L. B. Selinger and Ming Li: Fingering Instability in Dislocation MotionD. Banerjee, R. Banerjee, and Y. Wang: An Alternative Mechanism for the Formation of Split Patterns of v' Precipitates in Ni-Al AlloysAli Sayir: Directional Solidification of Eutectic CeramicsD. Y. Li and L. Q. Chen: Computer Simulation of Microstructural Evolution under External StressesPeter E. D. Morgan et al.: The Weak Interface between Monazites and Refractory Ceramic OxidesMartina E. Bachlechner et al.: Structural Correlations and Stress Distribution at Silicon/Silicon Nitride InterfaceC.-K. Loong: Neutron-Scattering Studies of Nitride, Oxide, and Phosphate Ceramics and Their Relationship with Molecular Dynamics Simulations of High-Temperature PropertiesJames W. Richardson, Jr.: Neutron Scattering Characterization of Microstructure in Uranium Silicides, Ceramic Composites and Ni-Based AlloysJames D. Powers, Mikito Kitayama, and Andreas M. Glaeser: Fundamental Studies of Surfaces and Interfaces at High Temperature via Microdesigned InterfacesI. Oleinik et al.: Analytic Bond-Order Potentials: Bridging the Electronic-Atomistic Length-Scale GapMasanori Kohyama and John Hoekstra: Ab Initio Calculations of Interfaces in Materials: Grain Boundaries in SiC and SiC/Al InterfacesKenji Tsuruta et al.: Structure and Dynamics of Consolidation and Fracture in Nanophase Ceramics via Parallel Molecular DynamicsRichard W. Goettler et al.: Interfaces in Oxide Fiber-Oxide Matrix Ceramic CompositesD. E. Ellis et al.: Hybrid Classical and Quantum Modeling of Defects, Interfaces, and SurfacesL. H. Yang and C. Mailhiot: First-Principles Pseudopotential Data Base of SilicaJose P. Rino et al.: Structural Correlations in Amorphous SiO2 at High PressuresHiroshi Iyetomi, Hideaki Kikuchi, and Akira Hasegawa: Development of a Variational Augmented Plane Wave Method and Its Application to the Electronic Structure of Ionic CompoundsHideaki Kikuchi, Hiroshi Iyetomi, and Akira Hasegawa: Band-Theoretical Approach to the Superionic Conductivity of Solid ElectrolytesChristian Mailhiot: The DOE Accelerated Strategic Computing Initiative: Challenges and Opportunities for Predictive Materials Simulation CapabilitiesMichael E. Papka, Rick Stevens, and Matthew Szymanski: Collaborative Virtual Reality Environments for Computational Science and DesignAiichiro Nakano et al.: Multilevel Algorithms for Computational High-Temperature Materials ResearchMing L. Wang and Zhen Lei Chen: Modified Gauss Point Method and Its Application in HTMSH. L. Fraser: Issues Involving Structural Stabilities in Multilayered Materials and Intermetallic CompoundsP. S. Lomdahl et al.: Recent Advances in High Performance Computer Simulations for Materials ScienceD. W. Brenner et al.: Multiscale Modeling of Polycrystalline Covalent CeramicsKai Wang and Robert R. Reeber: High Temperature Thermal Property Prediction for MgO, KCl and ZnSPei Zeng, Philip C. Clapp, and Jon A. Rifkin: Failure of Herring's Sintering Law at the NanoscaleJeremy Q. Broughton: Atomistic Simulation of MEMS Devices via the Coupling of Length ScalesAndrew V. G. Chizmeshya, W. T. Petusky, and G. H. Wolf: Thermoelastic Properties of Layered Perovskites: A Non-Empirical Density Functional Theory ApproachIndex