Controlling Conducted Emissions By Design by J. FlukeControlling Conducted Emissions By Design by J. Fluke

Controlling Conducted Emissions By Design

byJ. Fluke

Paperback | March 14, 2012

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This book presents a useful way to "design in" electromagnetic compatibility (EM C). EMC design considerations are often an addendum to the design. These Band-Aid fixes are not the best approach most of the time but are all that is possible at a late stage in the design and development process. This book is not the classic "EMI fix cookbook"; it is intended for all electronics design engineers. The analytical tools presented enable the designer to address EMC considerations early in the design process. Power conversion engineers will find the enclosed information especially important because of the inherent conducted emissions problems in power conversion equipment. Switching power supplies are commonly the most significant noise generators in electronic systems. In most design work, if the conducted emission problem is addressed, good layout and packaging will ensure that the conducted and radiated electromagnetic interference (EM!) requirements are met. The EMI process involves three components: source, path, and victim. These elements are easily modeled on the computer. The methods of modeling and analysis on the computer are the essence of this book. The EMI source is analyzed using the FFr and the results are applied to a computer model of the path and victim (test setup). The resulting currents are measured and compared to a standard.
Title:Controlling Conducted Emissions By DesignFormat:PaperbackDimensions:334 pages, 22.9 × 15.2 × 1.73 inPublished:March 14, 2012Publisher:Springer-Verlag/Sci-Tech/TradeLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:9401170266

ISBN - 13:9789401170260

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Table of Contents

I. Fundamentals of Conducted Emission Design.- 1. Designing for EMC.- 1.1 Noise (EMI).- 1.2 EMI Source, Path, and Victim.- 1.3 Conductive Paths.- 1.4 Conduction or Radiation?.- 1.5 Design to Control Conducted Emissions.- 2. EMI Spectrum.- 2.1 Time and Frequency Domains.- 2.2 Description of FFT Software.- 2.3 Data Interpretation.- 2.4 Bare Bones FFT.- 2.5 Methods of Inputting Data to FFT.- 2.6 An Enhanced Version of FFT.- 2.7 Examples of FFT Conversions from Time to Frequency Domains.- 2.8 Some Possible Pitfalls.- 2.9 Subharmonics.- 3. Capacitor Modeling.- 3.1 The Capacitor Model.- 3.2 Parasitic Elements of Capacitors.- 3.3 Capacitor Types.- 3.4 Capacitor Voltage Ratings.- 4. Inductor Modeling.- 4.1 Inductor Losses.- 4.2 Inductor Capacitance.- 4.3 Air Core with Conductor Near Experiment.- 4.4 Inductor Cores Form Capacitive Paths.- 4.5 Inductor Impedance Curve.- 4.6 Parasitic Elements of Inductors.- 4.7 Simulation.- 5. Balun Modeling.- 5.1 Differential Mode Flux.- 5.2 Common Mode Flux.- 5.3 The Truth about Windings on Inductor Cores.- 5.4 Coupling K Factor.- 5.5 Differential Balun Inductance.- 5.6 Common Mode Balun Inductance.- 5.7 Effects of Load and Source Resistances on Attenuation.- 5.8 Balun Driving Impedance.- 5.9 Balanced Circuits.- 5.10 Design Criteria.- 5.11 Model.- 6. Filters.- 6.1 Parasitic Inductances and Capacitances.- 6.2 Academic LC Filter.- 6.3 Simple Real World LC Filter.- 6.4 Control Parasitics by Design.- 6.5 Parasitics Caused by Circuit Layout.- 6.6 Filter Circuit Design.- 6.7 Characteristic Impedance of LC Filters.- 6.8 Parallel Capacitors to Lower the ESR.- 6.9 LC Filter.- 6.10 Line Impedance Stabilization Networks.- 6.11 Filter Layout and Packaging Design.- 7. Grounding Electronic Circuits.- 7.1 Grounding.- 7.2 Safety Grounds.- 7.3 Ground Geometries.- 7.4 Ground Design for Packaging ElectronicCircuitry.- 7.5 Shielding.- 8. EMI Analysis.- 8.1 EMI Modeling.- 8.2 EMI Analysis Using SPICE.- II. Advanced Conducted Emission Design.- 9. EMC Regulations.- 9.1 FCC.- 9.2 VDE.- 9.3 MIL-STD-461.- 9.4 Voltage/LISN Measurement Method.- 9.5 Current/Capacitor Measurement Method.- 9.6 A Comparison of Some of the RF Conducted Emissions Standards.- 10. Switch Mode Power Supplies.- 10.1 Typical Power Supply Block Diagram.- 10.2 Typical Switch Mode Power Supply EMI Problem Areas.- 10.3 EMI Simulation and Laboratory EMI Test Setup.- 10.4 SMPS EMI Design Example.- 10.5 Model the Problem.- 10.6 Simulation Problems.- 10.7 Back to Fundamental Model.- 10.8 Identify the Players.- 10.9 Other Types of EMI Modeling for SMPS.- 10.10 Conclusion.- 11. Transistor and Diode Packaging Problem for EMI.- 11.1 New Semiconductor Device Packages.- 11.2 Common Mode Shorting Screens.- 11.3 Typical System with Power Conversion.- 11.4 Common Mode Current Paths.- 11.5 Conducted Emissions Reduction by Choice of Package.- 12. Circuit Examples.- 12.1 Example 1.- 12.2 Example 2.- 12.3 Example 3 (FFT).- 13. Computers and Digital Logic Circuitry.- 13.1 Conducted Emissions Coupling Paths.- 13.2 Sequential Logic and Clocks.- 13.3 Example of Internal Conducted Emissions.- 13.4 What Is the Best Bypass Capacitor?.- 13.5 Power Entry Capacitor.- 14. What This Analysis Method Is Not.- 14.1 Diagnostics.- 14.2 Fields.- 14.3 Radiation.- 14.4 Characteristic Impedances of Common Pairs of Conductors.- 14.5 Shortcomings of EMI Test Simulation as Described Herein.- 15. Magnetic Saturation Modeling.- 15.1 The Polarization of Magnetic Domains.- 15.2 Device, Core, and Material Properties.- 15.3 Core Geometry Effects.- 15.4 Effects of Cores Made of Two Different Materials.- 15.5 Some Crucial Parameters to Model Saturation.- 15.6 Methods of Integrating Voltage.- 15.7 Dr. Lauritzen's Saturation Model.- 15.8 The Core Geometry and Material Porosity Region of the B-H Loop.- 15.9 Curve Fitting versus Parametric Models.- 15.10 Conclusion.- Appendix. BASIC FFT.