Electrical Design of Through Silicon Via by Manho LeeElectrical Design of Through Silicon Via by Manho Lee

Electrical Design of Through Silicon Via

byManho LeeEditorJun So Pak, Joungho Kim

Hardcover | May 20, 2014

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Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Manho Lee received the B.S. and M.S. degrees in electrical engineering from the Korea Advanced Institute of Science and Technology, Daejeon, Korea, in 2010 and 2012, respectively, where he is currently pursuing the Ph.D. degree in electrical engineering.His current research interests include the modeling of noise coupling between activ...
Title:Electrical Design of Through Silicon ViaFormat:HardcoverDimensions:280 pagesPublished:May 20, 2014Publisher:Springer-Verlag/Sci-Tech/TradeLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:940179037X

ISBN - 13:9789401790376

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Table of Contents


Chapter 1 Introduction. 1.1 TSV-based 3D ICs. 1.2 Core Technologies and Electrical Reliability Design for TSV-based 3D IC. 1.3 Electrical Analysis of TSVs based on MIS Analysis. References.

Chapter 2 Electrical Modeling of a Through-Silicon Via (TSV). 2.1 Introduction. 2.2 Equivalent Circuit Model of a TSV. 2.3 Electrical Characterization and Analysis of a TSV Channel. 2.4 Electrical Analysis of a Single-ended and Differential Signal TSV Channel. 2.5 Summary. References.

Chapter 3 High-speed TSV-based Channel Modeling and Design. 3.1 Introduction. 3.2 Model of High-speed TSV-based Channel. 3.3 Analysis of High-speed TSV-based Channel. 3.4 Worst-case Eye-diagram Estimation Algorithm. 3.5 Summary. References.

Chapter 4 Noise Coupling and Shielding in 3D ICs. 4.1 Overview. 4.2 Analysis of Noise Coupling in 3D ICs. 4.3 Analysis of Shielding Structures in 3D-IC. 4.4 Summary. References.

Chapter 5 Thermal Effects on TSV Signal Integrity. 5.1 Overview. 5.2 Temperature-dependent TSV Isolation Characteristics and Model. 5.3 Temperature-dependent TSV Channel. 5.4 Summary. References.

Chapter 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain. 6.1 Introduction. 6.2 Modeling of PDNs in TSV-based 3D-ICs. 6.3 Analysis of the PDN Impedance in TSV-based 3D-ICs in the Frequency Domain. 6.4 Summary. References.

Chapter 7 TSV Decoupling Schemes. 7.1 Introduction. 7.2 Decoupling Capacitor Schemes. 7.3 Application and Design of TSV-based Decoupling Schemes. 7.4 Summary. References.