Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via

Kobo ebook | May 11, 2014

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Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Title:Electrical Design of Through Silicon ViaFormat:Kobo ebookPublished:May 11, 2014Publisher:Springer NetherlandsLanguage:English

The following ISBNs are associated with this title:

ISBN:9990044741780

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