Electronic Assembly Fabrication: Circuit Boards, Packages and Components

Hardcover | April 10, 2002

byCharles Harper

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* Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition


* Non-specialists guide to assembly fabrication--no advance degrees or math background necessary

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From the Publisher

* Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition* Non-specialists guide to assembly fabrication--no advance degrees or math background necessary

CHARLES A. HARPER is the President of Technology Seminars, Inc., an organization which provides educational training courses in electronic packaging and manufacturing to business and industry. He also had an earlier esteemed career with Westinghouse in this field. Widely recognized as one of the leaders in this industry, he has autho...

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Format:HardcoverDimensions:672 pages, 9.1 × 6.2 × 2.07 inPublished:April 10, 2002Publisher:McGraw-Hill EducationLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0071378820

ISBN - 13:9780071378826

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Extra Content

Table of Contents

Preface

Contributors

Dedication

Chapter 1: Printed Circuit History and Overview

Chapter 2: Development and Fabrication of IC Chips

Chapter 3: Packaging of IC Chips

Chapter 4: Laminates and Prepregs as Circuit Board Base Materials

Chapter 5: Printed Circuit Board Fabrication

Chapter 6: Package and Component Attachment and Interconnection

Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication

Chapter 8: Printed Wiring Board Cleaning

Chapter 9: Board Coating Materials and Processes

Chapter 10: Flexible and Rigid Flexible Fabrication

Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites

Chapter 12: Hybrid Microelectronics and Multichip Module Technologies

Chapter 13: Environmental Considerations in Electronic Assembly Fabrication

Index

About the Editor