Electronic Packaging And Interconnection Handbook 4/e by Charles A. HarperElectronic Packaging And Interconnection Handbook 4/e by Charles A. Harper

Electronic Packaging And Interconnection Handbook 4/e

byCharles A. Harper

Hardcover | October 19, 2004

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THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING-;COMPLETELY UPDATED From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbookoffers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved inthe design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on keyMEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field,allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbookmakes an excellent addition to your reference arsenal. Written by a team of experts from around the globe, this remarkable volume covers allaspects of electronic packaging, including: Materials Thermal Management Shock, Vibration, and Operational Stress Management Connector and Interconnection Technologies Soldering and Cleaning Technologies Single Chip Packaging and Ball Grid Arrays Surface Mount Technology Hybrid and Multichip Modules Chip-Scale, Flip-Chip, and Direct-Chip Attachment Rigid and Flexible Printed-Wiring Boards Packaging High-Speed and Microwave Systems Packaging High-Voltage Systems Packaging of MEMs Systems Packagingof Optoelectronic Systems
Charles A. Harper is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials. He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics ...
Title:Electronic Packaging And Interconnection Handbook 4/eFormat:HardcoverDimensions:1000 pages, 9.6 × 7.5 × 1.9 inPublished:October 19, 2004Publisher:McGraw-Hill EducationLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0071430482

ISBN - 13:9780071430487

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Table of Contents



Chapter 1: Plastics, Elastomers, and Composites

Chapter 2: Adhesives, Underfills, and Coatings

Chapter 3: Thermal Management

Chapter 4: Connector and Interconnection Technology

Chapter 5: Solder Technologies for Electronic Packaging and Assembly

Chapter 6: Packaging and Interconnection of Integrated Circuits

Chapter 7: Hybrid Microelectronics and Multichip Modules

Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies

Chapter 9: Rigid and Flexible Printed Circuit Board Technology

Chapter 10: Packaging of High-Speed and Microwave Electronic Systems


Editorial Reviews

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies.