Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by Ricky S.W. LeeElectronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by Ricky S.W. Lee

Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

byRicky S.W. Lee, C.P. Wong, Ning-Cheng Lee

Hardcover | September 13, 2002

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ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growingfield. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical andmarketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives
John H. Lau received his PhD in theoretical and applied mechanics from the University of Illinois, an MASc in structural engineering from the University of British Columbia, a second MS in engineering physics from the University of Wisconsin, and a third MS in management science from Fairleigh Dickinson University. He also has a BE in...
Title:Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive MaterialsFormat:HardcoverDimensions:9.1 × 6.1 × 2 inPublished:September 13, 2002Publisher:McGraw-Hill EducationLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0071386246

ISBN - 13:9780071386241

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Table of Contents

Chapter 1: Introduction to Environmentally Benign Electronics Manufacturing

Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps

Chapter 3: WLCSP with Lead-Free Solder Bumps on PCB/Substrate

Chapter 4: Chip (Wafer)-Level Interconnects with Solderless Bumps

Chapter 5: WLCSP with Solderless Bumps on PCB/Substrate

Chapter 6: Environmentally Benign Molding Compounds for IC Packages

Chapter 7: Environmentally Benign Die Attach Films for IC Packaging

Chapter 8: Environmental Issues for Conventional PCBs

Chapter 9: Halogenated and Halogen-Free Materials for Flame Retardation

Chapter 10: Fabrication of Environmentally Friendly PCB

Chapter 11: Global Status of Lead-Free Soldering

Chapter 12: Development of Lead-Free Solder Alloys

Chapter 13: Prevailing Lead-Free Alloys

Chapter 14: Lead-Free Surface Finishes

Chapter 15: Implementation of Lead-Free Soldering

Chapter 16: Challenges for Lead-Free Soldering

Chapter 17: Introduction to Conductive Adhesives

Chapter 18: Conductivity Establishment of Conductive Adhesives

Chapter 19: Mechanisms Underlying the Unstable Contact Resistance of ECAs

Chapter 20: Stabilization of Contact Resistance of Conductive Adhesives


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