Dry Etching Technology For Semiconductors by Kazuo NojiriDry Etching Technology For Semiconductors by Kazuo Nojiri

Dry Etching Technology For Semiconductors

byKazuo Nojiri

Hardcover | November 3, 2014

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This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Kazuo Nojiri is a CTO of Lam Research Japan. He has 37 years of experience in semiconductor industry. Prior to joining Lam in 2000, he worked for Hitachi Ltd. for 25 years, where he held numerous management positions for Dry Etching and Device Integration. He is also known as a pioneer in the research field of charging damage. He publi...
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Title:Dry Etching Technology For SemiconductorsFormat:HardcoverDimensions:116 pagesPublished:November 3, 2014Publisher:Springer-Verlag/Sci-Tech/TradeLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:331910294X

ISBN - 13:9783319102948

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Table of Contents

Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.

Editorial Reviews

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.  The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.  The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.