Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management

EditorPaul D. Franzon, Erik Jan Marinissen, Muhannad S. Bakir

Hardcover | May 6, 2019

Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management by Paul D. Franzon
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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.
Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.
Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
 
Paul D. Franzon is currently the Cirrus Logic Distinguished Professor of Electrical and Computer Engineering and Director of Graduate programs in ECE at North Carolina State University. He earned his PhD from the University of Adelaide, Adelaide, Australia. He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Tel...
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Title:Handbook of 3D Integration, Volume 4: Design, Test, and Thermal ManagementFormat:HardcoverProduct dimensions:488 pages, 9.8 X 6.8 X 1 inShipping dimensions:488 pages, 9.8 X 6.8 X 1 inPublished:May 6, 2019Publisher:WileyLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:3527338551

ISBN - 13:9783527338559

Appropriate for ages: All ages

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