High Power Diode Lasers: Technology and Applications by Friedrich Bachmann

High Power Diode Lasers: Technology and Applications

EditorFriedrich Bachmann, Peter Loosen, Reinhart Poprawe

Hardcover | March 12, 2007

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This book summarizes a five year research project, as well as subsequent results regarding high power diode laser systems and their application in materials processing. The text explores the entire chain of technology, from the semiconductor technology, through cooling mounting and assembly, beam shaping and system technology, to applications in the processing of such materials as metals and polymers. Includes theoretical models, a range of important parameters and practical tips.

About The Author

Poprawe: University Professor with simultaneous responsibility for an application oriented Fraunhofer Institute (ILT, Aachen); The every day business is defined between research, teaching on the University level and Innovation for German, European and global companies. Loosen: University professor and deputy chair of the Fraunhofer-I...

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Title:High Power Diode Lasers: Technology and ApplicationsFormat:HardcoverDimensions:560 pages, 9.25 × 6.1 × 0.03 inPublished:March 12, 2007Publisher:Springer New YorkLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0387344535

ISBN - 13:9780387344539

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Table of Contents

1Motivation and introduction2High power diode laser technlogy and characteristics2.1Principles of diode operation2.2Manufacturing technology2.3Chip characterization methods and operation2.4Broad area emitters and arrays2.5High brightness emitters and arrays 3Packaging of diode laser bars3.1General aspects3.2Mounting of diode laser bars3.3Cooling3.3.1Introduction3.3.2 Conduction cooling3.3.3Micro-channel heatsinks3.3.4Heatspreaders3.4Expansion-matched packages3.5Mounting of micro-optics4Stacking and incoherent superposition4.1 Introduction and Survey4.2 Beam collimation4.3 Techniques for Beam Combination4.4 Stacking Techniques4.5 Beam symmetrization and fiber coupling4.6 Beam-Quality limits and comparison to coherent coupling5 Laser systems: beam characteristics, metrology and standards5.1 Introdiuction5.2 Theoretical background of beam propagation5.2.1 Preliminaries5.2.2 Temporal integration, coherence5.2.3 Wigner distribution5.2.4 Propagation of the Wigner distribution through linear optical systems5.3 Density distribution5.3.1 Power density distribution in the far field5.3.2 Width of a power density distribution in a transverse plane5.4 Propagation of the beam width5.4.1 Theoretical background5.4.2 Beam classification5.4.3 Propagation of the beam width of stigmatic and simple astigmatic beams5.5. Measurement of the beam power5.6 Measurement of the power density distribution and the beam propagation ratio, M²5.6.1 Camera systems5.6.2 Mechanical scanning devices5.6.3 Measuring beam caustics5.6.4 Power density in the far field measurement5.6.5 Evaluating the widths of a measured power density distribution5.6.6 Determination of the beam propagation ration, M²5.7 Beam positional stability5.8 Wavefront of a laser5.9 Lifetime5.10 Table of international standards related to laser metrology5.11 References6 Diode laser systems6.1 Introduction6.2 Multi purpose laser systems6.2.1 Optical cutting plotter with 100 W 6.2.2 Free space propagation systems in the kW range 6.2.3 Fibre coupled system in the kW range6.2.4 High brightness system with 100 W6.2.5 High brightness kW system6.3 Modular diode laser systems6.3.1 Soldering laser, integrated into a gripping tool - pick and join6.3.2 Individually addressable intensity line6.3.3 Line modules for contour adapted plastics welding6.3.4 Diode laser line cutter6.3.5 Annular diode laser tool6.3.6 Process controlling modular diode laser system for transformation hardening6.3.7 Ring shaped laser for laser assisted machining6.4  List of symbols6.5 References7 Applications7.1 Joining technologies7.1.1 Introduction7.1.2 Metal welding7.1.3 Brazing7.1.4 Soldering7.1.5 Laser Beam Welding of Thermoplastics7.1.6 References7.2 Cutting and laser assisted machining technologies7.2.1  Introduction7.2.2 Precision cutting with the optical cutting plotter7.2.3 Single-shot cutting-to-length7.2.4 Oxygen cutting with annular beam7.2.5 Laser asisted machining7.3 Surface treatment7.3.1 Introduction7.3.2 Hardening7.3.2.1  Process principles and equipment7. Differences between / principles of hardening and remelting7. Absorption depending on angle of incidence, material, surface roughness, comparison with absorption of other lasersystems7. simulation of heat conduction 1- / more-dimensional, process modelling, influence on distorsion7. microstructural change during hardening comparison of laser hardening with other sources of heat7. Process monitoring, different kinds of process control/ sensors, dis-/advantages, special features using HPDL7. special equipment7.3.2.2 Parameter dependencies7.3.2.3 Application results7.3.3 Layer deposition for generation and repair7.3.3.1  Process principles and equipment7. differences between / principles of alloying, layer deposition and dispersing of hard material7. build up depending on angle of incidence, material, surface roughness, comparison with absorption of other lasersystems7. simulation of heat input in comparison to other coating technologies, simulation of residual stresses7. process strategy for repair of tools - CAx process chain7. microstructural change during layer deposition, comparison to laser deposition systems and with other sources of heat7. basics of layer deposition with different materials7. special equipment (mobile cladding system, powder feed nozzles) differences between laser cladding and atmospheric plasma spraying, the principle of the laser assisted atmospheric plasma spray process7.3.3.2 Parameter dependencies7. Cladding of a Co-based alloys7.3.3.3 Application results7. of valve seats7.3.4 References 8 Conclusion, outlook acknowledgement