Mechanics of Microelectronics by G.Q. ZhangMechanics of Microelectronics by G.Q. Zhang

Mechanics of Microelectronics

byG.Q. Zhang, W.D. van Driel, X.J. Fan

Paperback | November 22, 2010

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The technology trends of Microelectronics and Microsystems are mainly characterized by miniaturization down to the nano-scale, increasing levels of system and function integration, and the introduction of new materials, while the business trends are mainly characterized by cost reduction, shorter-time-to market and outsourcing. Combination of these trends leads to increasing design complexity, dramatically decreasing design margins and process windows, reducing product development and qualification times, increasing risks of failures, and increasing difficulties to meet quality, robustness and reliability requirements. Consequentially, thermo-mechanical related failures, accounting for more than 65% of the total reliability failures, become the bottleneck for both current and future product and technology developments. From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies, covering the contents of:The trends in Microelectronics and MicrosystemsReliability engineering and practicesThermal managementAdvanced mechanics Thermo-mechanics of integrated circuits and packagesCharacterization and modelling of moisture behaviourCharacterization and modelling of solder joint reliabilityVirtual thermo-mechanical prototypingChallenges and future perspectives.

Details & Specs

Title:Mechanics of MicroelectronicsFormat:PaperbackDimensions:586 pages, 9.45 × 6.3 × 0.03 inPublished:November 22, 2010Publisher:Springer NetherlandsLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:9048172314

ISBN - 13:9789048172313

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Table of Contents

Microelectronics technologyIntroductionA heart of siliconIn a little black boxBaseline CMOSNon-CMOS optionsPackagingSystemsConclusionsReferencesNomenclatureReliability practicesIntroductionReliability assessmentReliability statisticsAcceleration factor modelsFailure mechanismsConclusionsReferencesExercisesThermal ManagementIntroductionHeat transfer basicsThermal design of assembliesThermal design for a SQFPHeatsink design choicesConclusions / final remarksReferencesIntroduction to Advanced MechanicsIntroductionStress and strainFailure criteriaFracture mechanicsFinite element methodReferencesExercisesThermo-Mechanics of Integrated Circuits and PackagesIntroductionIC Backend and packaging processes and testingThermo-mechanics of IC backend processesThermo-Mechanics of packaging processesThermo-Mechanics of coupled IC backend and packaging processesCase studiesReferencesExercisesCharacterization and Modeling of Moisture BehaviorIntroductionMoisture diffusion modelingCharacterization of moisture diffusivity and saturation concentrationVapor pressure modelingHygroscopic swelling characterization & modelingSingle void Instability behavior Subjected to vapor pressure and thermal stressInterface strength characterization and modelingCase studiesReferencesExercisesCharacterization and Modeling of Solder Joint ReliabilityIntroductionAnalytical-empirical prognosis of the reliabilityThermo-mechanical characteristics of soft soldersData evaluation and LIFE-time estimationCase studiesReferencesExercisesVirtual thermo-mechanical prototyping IntroductionThe state-of-the-art of virtual prototyping Case studiesConclusionsReferencesExercisesChallenges and future perspectivesIntroductionProduct and process inputsTests and experimentsMulti-scale mechanicsAdvanced simulation toolsMulti-physics modelingMaterial and interface behaviorSimulation-based optimizationConclusionsReferences

Editorial Reviews

From the reviews:"This is an introductory treatise on the mechanism of microelectronics that has penetrated into every aspects of human life for the past half of a century. . The treatise should be of interest to both the academia and industry, and it can be used as a 'basic source for teaching' in a graduate course. . In sum, the authors have done a valuable service in presenting the title topic to researchers, engineers and students interested in the mechanics of microelectronics." (M. Cengiz Dökmeci, Zentralblatt MATH, Vol. 1105 (7), 2007)"The editors of Mechanics of Microelectronics present this book, as their obligation, to graduate students in universities, researchers, engineers and managers in industries. . The book chapters are written by the worldwide leading experts with both profound theoretical achievement and rich industrial experience . . The book will be eagerly sought after by microelectronics and microsystems design engineers; process/product development engineers; reliability engineers; thermal, mechanical and multi-physics analysts; researchers, graduates and PhD students and their guides." (Current Engineering Practice, 2007)