Reliability and Failure of Electronic Materials and Devices

Paperback | October 21, 2014

byMilton Ohring, Lucian KasprzakEditorMilton Ohring

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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and pr...

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of th...

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Format:PaperbackDimensions:758 pages, 8.75 × 6.35 × 0.68 inPublished:October 21, 2014Publisher:Academic PressLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0120885743

ISBN - 13:9780120885749

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Table of Contents

CH 1 An Overview of Electronic Devices and Their Reliability
CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
CH 3 Defects, Contamination and Yield
CH 4 The Mathematics of Failure and Reliability
CH 5 Mass Transport-Induced Failure
Ch 6 Electronic Charge-Induced Damage
CH 7 Environmental Damage to Electronic Products
CH 8 Packaging Materials, Processes, and Stresses
CH 9 Degradation of Contacts and Packages
CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices
CH 11 Characterization and Failure Analysis of Material, Devices and Packages
CH 12 Future Directions and Reliability Issues