Semiconductor Process Reliability in Practice

Hardcover | October 31, 2012

byZhenghao Gan, Waisum Wong, Juin Liou

not yet rated|write a review

Proven processes for ensuring semiconductor device reliability

Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

Coverage includes:

  • Basic device physics
  • Process flow for MOS manufacturing
  • Measurements useful for device reliability characterization
  • Hot carrier injection
  • Gate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)
  • Negative bias temperature instability
  • Plasma-induced damage
  • Electrostatic discharge protection of integrated circuits
  • Electromigration
  • Stress migration
  • Intermetal dielectric breakdown

Pricing and Purchase Info

$154.76 online
$173.95 list price (save 11%)
In stock online
Ships free on orders over $25

From the Publisher

Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial spec...

Zhenghao Gan is a reliability technical manager at the Semiconductor Manufacturing International Corporation (SMIC), Shanghai, China. He has extensive technical and management experience in research and development of semiconductor reliability improvement, testing/characterization, problem solving, project management, modeling, and ana...

other books by Zhenghao Gan

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability ...

Kobo ebook|Mar 28 2011

$123.89 online$160.90list price(save 23%)
Format:HardcoverDimensions:9.3 × 6.4 × 1.5 inPublished:October 31, 2012Publisher:McGraw-Hill EducationLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:007175427X

ISBN - 13:9780071754279

Look for similar items by category:

Customer Reviews of Semiconductor Process Reliability in Practice

Reviews