Semiconductor Process Reliability in Practice by Zhenghao GanSemiconductor Process Reliability in Practice by Zhenghao Gan

Semiconductor Process Reliability in Practice

byZhenghao Gan, Waisum Wong, Juin J. Liou

Hardcover | October 31, 2012

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Proven processes for ensuring semiconductor device reliability

Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

Coverage includes:

  • Basic device physics
  • Process flow for MOS manufacturing
  • Measurements useful for device reliability characterization
  • Hot carrier injection
  • Gate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)
  • Negative bias temperature instability
  • Plasma-induced damage
  • Electrostatic discharge protection of integrated circuits
  • Electromigration
  • Stress migration
  • Intermetal dielectric breakdown

Zhenghao Gan is a reliability technical manager at the Semiconductor Manufacturing International Corporation (SMIC), Shanghai, China. He has extensive technical and management experience in research and development of semiconductor reliability improvement, testing/characterization, problem solving, project management, modeling, and ana...
Title:Semiconductor Process Reliability in PracticeFormat:HardcoverDimensions:9.3 × 6.4 × 1.5 inPublished:October 31, 2012Publisher:McGraw-Hill EducationLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:007175427X

ISBN - 13:9780071754279

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