SMT Soldering Handbook

Other | February 1, 1998

bySTRAUSS, RUDOLF, Rudolf Strauss

not yet rated|write a review
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes.



Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author.

His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment.


Written by founding father of SMT technology
Standard specifications have been fully updated
New chapter covering Ball Grid Array (BGA) technology

Pricing and Purchase Info

$156.69 online
$203.41 list price (save 22%)
In stock online
Ships free on orders over $25

From the Publisher

Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant c...

Format:OtherDimensions:400 pages, 1 × 1 × 1 inPublished:February 1, 1998Publisher:NewnesLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0080480977

ISBN - 13:9780080480978

Customer Reviews of SMT Soldering Handbook

Reviews

Extra Content

Table of Contents

Why SMDs?; The SMD family; Soldering; Wave soldering; Reflow soldering; The circuit board; Component placement; Cleaning; Quality control and inspection; Rework; Index