Substrate Noise Coupling in RFICs by Ahmed HelmySubstrate Noise Coupling in RFICs by Ahmed Helmy

Substrate Noise Coupling in RFICs

byAhmed Helmy, Mohammed Ismail

Paperback | November 25, 2010

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The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors' knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series
Title:Substrate Noise Coupling in RFICsFormat:PaperbackDimensions:136 pages, 9.25 × 6.1 × 0 inPublished:November 25, 2010Publisher:Springer NetherlandsLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:9048177898

ISBN - 13:9789048177899

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Table of Contents

Abstract. Dedication. Acknowledgements. Vita. List of Tables. List of Figures.Chapter 1. Introduction.Motivation and Research Objectives. ContributionsThesis Organization.Chapter 2. Analysis of Substrate Noise Coupling.Process Regions.Process cross sections.Connection of devices to the substrate. Devices directly connected to the substrate network. Devices indirectly connected to the substrate network.Noise coupling mechanism. Substrate Noise Injection Mechanisms. Substrate Noise Reception Mechanisms. Substrate Noise Transmission Mechanisms.Substrate doping profile tradeoffs.Substrate Model extraction in the IC design flow.Doping Profile Considerations.Substrate model extraction kernels. Finite Difference method. Boundary Element method. Comparison between the two Techniques. Approximations in the Model Extraction Algorithm. Conclusion.Chapter 3. Experimental Data to calibrate the design flow.Introduction.The test chip.Baseline Isolation. Data analysis.Effect of p-guard ring on isolation. Data analysis.Effect of n-guard ring on isolation. Data analysis.Effect of deep n-well on isolation. Data analysis.Effect of deep trench on isolation. Data analysis.De-embedding.Conclusion.Chapter 4. Design Guide for Substrate Noise Isolation for RF ApplicationsIntroduction.Isolation in Low resistivity substrate.Isolation vs. Frequency for different isolation structures.Effect of back plane connection on the noise isolation in high resistivity substrates.Substrate Contacts: Front side or Backside? Both.P+ Guard Ring Isolation. Guard Ring Isolation vs. D. Guard Ring grounding scheme. Guard Ring Isolation vs. d. Guard Ring Isolation vs. "w".P+ and N+ Guard Rings Isolation.Floor planning techniques to minimize coupling.Circuit techniques to minimize coupling.Active guard rings.Conclusion.Chapter 5. On Chip Inductor Design Flow.Introduction.Integrated Inductors.Inductor Design Flow.Analytical exploration of the design space.Inductor Model and Substrate Parasitics.Calibrating the field solver.Model fit.DFM effects. Impact of bumps. Impact of temperature variation. Impact of process variation. Impact of metal fill.Conclusion.Chapter 6. Case studies for the impact and remedy of substrate noise coupling.Introduction.System Level Case study. Background. Design Data.Block Level Case study. Design details.Device Level Case study.Conclusion.Chapter 7. Conclusion and Future work.Appendix A Scattering Parameters.Appendix B Measurements Setup.Bibliography.