Thermal Management Handbook: For Electronic Assemblies

June 21, 1998|
Thermal Management Handbook: For Electronic Assemblies by Jerry E. Sergent
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The "hands-on" guide to thermal management! 

In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges - and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage - and preventing thermal-related problems from occurring in the first place.
Jerry E. Sergent, Ph.D., is the Director of Technology for TCA, Inc. Al Krum is an Engineering Manager at Hughes Aircraft. He also teaches hybrid and MCM classes at UCLA and Berkeley, as well as for IMAPS.
Title:Thermal Management Handbook: For Electronic AssembliesFormat:HardcoverProduct dimensions:9.3 X 6.3 X 0.9 inShipping dimensions:9.3 X 6.3 X 0.9 inPublished:June 21, 1998Publisher:McGraw-Hill EducationLanguage:English

The following ISBNs are associated with this title:

ISBN - 10:0070266999

ISBN - 13:9780070266995

Appropriate for ages: All ages

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