Thermal Management Handbook: For Electronic Assemblies: For Electronic Assemblies by Jerry E. SergentThermal Management Handbook: For Electronic Assemblies: For Electronic Assemblies by Jerry E. Sergent

Thermal Management Handbook: For Electronic Assemblies: For Electronic Assemblies

byJerry E. Sergent, Al Krum, IMAPS (ISHM)

Hardcover | June 21, 1998

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In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Jerry E. Sergent, Ph.D., is the Director of Technology for TCA, Inc. Al Krum is an Engineering Manager at Hughes Aircraft. He also teaches hybrid and MCM classes at UCLA and Berkeley, as well as for IMAPS.
Title:Thermal Management Handbook: For Electronic Assemblies: For Electronic AssembliesFormat:HardcoverDimensions:650 pages, 9.3 × 6.3 × 0.9 inPublished:June 21, 1998Publisher:McGraw-Hill Education

The following ISBNs are associated with this title:

ISBN - 10:0070266999

ISBN - 13:9780070266995

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Table of Contents

Introduction.Electronic Packaging Technology.Thermal Properties of Electronic Materials.Heat Generation in Electronic Circuits.Basic Thermal Analysis.Thermal Analysis of Electronic Assemblies.Cooling of Electronic Assemblies.Data.