Three-dimensional Integration Of Semiconductors: Processing, Materials, And Applications

March 28, 2019|
Three-dimensional Integration Of Semiconductors: Processing, Materials, And Applications by Kazuo Kondo
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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Kazuo Kondo is Professor at Department of Chemical engineering, Osaka Prefecture University. He took his PhD in Chemical Engineering at the University of Illinois in 1981. He has worked for Sumitomo Metal Industries, Hokkaido University and Okayama University. He has 200 research publications and 100 patents. His major research is Copp...
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Title:Three-dimensional Integration Of Semiconductors: Processing, Materials, And Applications
Format:Paperback
Product dimensions:408 pages, 9.25 X 6.1 X 0 in
Shipping dimensions:408 pages, 9.25 X 6.1 X 0 in
Published:March 28, 2019
Publisher:Springer Nature
Language:English
Appropriate for ages:All ages
ISBN - 13:9783319792552

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